ความเป็นเลิศด้านวิศวกรรม
The very low profile IKC J-bend half pitch DIP switch is designed for reliable operation with an extremely small PCB space requirement. Process compatible (withstand IR reflow soldering) and washable (tape seal standard).
The switch has 1,27 mm (.050) terminal to terminal pitch. It has an overall height from PCB : 1,7 mm (.067). Designed to be a very small PCB space requirement.
Process compatible – withstand IR reflow soldering. Washable (tape seal standard).
View all DIP switches here.
The very low profile APEM IKC J-bend half pitch DIP switch is designed for reliable operation with an extremely small PCB space requirement. Process compatible (withstand IR reflow soldering) and washable (tape seal standard).
View all APEM products here.
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• Gold plated contact to ensure low resistance and long mechanical life.
ENVIRONMENTAL SPECIFICATIONS
• Operating temperature: -25°C to +70°C
• Storage temperature: -40°C to +85°C
MATERIALS
• Case: Polyamide
• Base: Polyamide
• Actuator: Polyamide
• Contact spring: Copper beryllium alloy
• Terminal: Gold plated
• Contact: Gold plated
• Max. current/voltage rating: 25mA 24VDC
• Contact rating: 100mA
• Initial contact resistance: 100mΩ max
• Insulation resistance: 500MΩ min. at 100VDC
• Dielectric strength: 300VAC Min. for 60 seconds
• Actuation force: 800gf (7.84N) Max
• Mechanical life: 1,000 cycles
